HF115AC-0.0055-AC-105 is available for purchase but is not normally stocked.
Available Substitutes:

Similar

A10832-02
Laird Technologies - Thermal Materials
In Stock: 17
Unit Price: RM209.71000
Datasheet
View and Compare All Substitutes
HF115AC-0.0055-AC-105
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

HF115AC-0.0055-AC-105

DigiKey Part Number
BER170-ND
Manufacturer
Bergquist
Manufacturer Product Number
HF115AC-0.0055-AC-105
Description
THERM PAD 36.83X21.29MM W/ADH
Customer Reference
Detailed Description
Thermal Pad Gray 36.83mm x 21.29mm Rectangular Adhesive - One Side
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Bergquist
Series
Hi-Flow® 115-AC
Packaging
Bulk
Part Status
Active
Usage
SIP
Type
Pad, Sheet
Shape
Rectangular
Outline
36.83mm x 21.29mm
Thickness
0.0055" (0.140mm)
Material
Phase Change Compound
Adhesive
Adhesive - One Side
Backing, Carrier
Fiberglass
Color
Gray
Thermal Resistivity
0.35°C/W
Thermal Conductivity
0.8W/m-K
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
-
Base Product Number
HF115AC
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

Manufacturer Quote Required
This product requires a manufacturer-approved quote before it can be ordered. Orders must meet the manufacturer’s standard package quantity, may be subject to extended lead times, and cannot be canceled or returned. Quotes are typically processed within 3–5 business days after submission.
Login or Register to request a quote.