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Gap Pad® VO ultra soft for filling air gaps features thermal conductivity of 1.0 W/m-K and is designed for low-stress applications.
Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness.
The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies.
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How the insulated metal substrate boards work along with an overview of the T-Clad PA-Bond-Ply 450 thermal interface material.Duration: 5 minutes
Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.Duration: 15 minutes
Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.Duration: 5 minutes
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