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Compare Parts Datasheets Image Digi-Key Part Number Manufacturer Part Number Manufacturer Description Quantity Available
Unit Price
MYR
Minimum Quantity Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
A 08-LC-TT Datasheet A 08-LC-TT - Assmann WSW Components AE9986-ND A 08-LC-TT CONN IC DIP SOCKET 8POS TIN 26,762 - Immediate Available: 26,762 RM0.75000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin
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Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin
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Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
A 14-LC-TT Datasheet A 14-LC-TT - Assmann WSW Components AE9989-ND A 14-LC-TT CONN IC DIP SOCKET 14POS TIN 58,233 - Immediate Available: 58,233 RM0.92000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin
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Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin
-
Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
A 18-LC-TT Datasheet A 18-LC-TT - Assmann WSW Components AE9995-ND A 18-LC-TT CONN IC DIP SOCKET 18POS TIN 20,857 - Immediate Available: 20,857 RM1.13000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin
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Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin
-
Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
ED281DT Datasheet ED281DT - On Shore Technology Inc. ED3050-5-ND ED281DT CONN IC DIP SOCKET 28POS TIN 14,687 - Immediate Available: 14,687 RM1.38000 1 Minimum: 1 Tube ED Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 110°C
AR 08 HZL-TT Datasheet AR 08 HZL-TT - Assmann WSW Components AE10011-ND AR 08 HZL-TT CONN IC DIP SOCKET 8POS TIN 28,311 - Immediate Available: 28,311 RM2.09000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin
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Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
4808-3004-CP Datasheet 4808-3004-CP - 3M 3M5473-ND 4808-3004-CP CONN IC DIP SOCKET 8POS TIN 13,994 - Immediate Available: 13,994 RM2.13000 1 Minimum: 1 Tube 4800 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
4816-3000-CP Datasheet 4816-3000-CP - 3M 3M5463-ND 4816-3000-CP CONN IC DIP SOCKET 16POS TIN 8,346 - Immediate Available: 8,346 RM2.13000 1 Minimum: 1 Tube 4800 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
110-44-314-41-001000 Datasheet 110-44-314-41-001000 - Mill-Max Manufacturing Corp. ED90049-ND 110-44-314-41-001000 CONN IC DIP SOCKET 14POS TIN 3,145 - Immediate Available: 3,145 RM3.18000 1 Minimum: 1 Tube 110 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-308-41-001000 Datasheet 110-43-308-41-001000 - Mill-Max Manufacturing Corp. ED90032-ND 110-43-308-41-001000 CONN IC DIP SOCKET 8POS GOLD 11,086 - Immediate Available: 11,086 RM3.22000 1 Minimum: 1 Tube 110 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
08-3518-10 Datasheet 08-3518-10 - Aries Electronics A400-ND 08-3518-10 CONN IC DIP SOCKET 8POS GOLD 4,662 - Immediate Available: 4,662 RM3.22000 1 Minimum: 1 Bulk 518 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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AR 14 HZL-TT Datasheet AR 14 HZL-TT - Assmann WSW Components AE10012-ND AR 14 HZL-TT CONN IC DIP SOCKET 14POS TIN 3,155 - Immediate Available: 3,155 RM3.30000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin
-
Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A-CCS 044-Z-SM Datasheet A-CCS 044-Z-SM - Assmann WSW Components AE11107-ND A-CCS 044-Z-SM IC SOCKET PLCC 44POS TIN SMD 19,786 - Immediate Available: 19,786 RM3.43000 1 Minimum: 1 Tube
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Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled -40°C ~ 105°C
AR 16 HZL-TT Datasheet AR 16 HZL-TT - Assmann WSW Components AE10013-ND AR 16 HZL-TT CONN IC DIP SOCKET 16POS TIN 10,041 - Immediate Available: 10,041 RM3.76000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin
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Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A-CCS 032-Z-SM Datasheet A-CCS 032-Z-SM - Assmann WSW Components AE11105-ND A-CCS 032-Z-SM IC PLCC SOCKET 32POS TIN SMD 8,870 - Immediate Available: 8,870 RM3.76000 1 Minimum: 1 Tube
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Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled -40°C ~ 105°C
1050281001 Datasheet 1050281001 - Molex WM6827TR-ND 1050281001 CONN CAM SOCKET 32POS GOLD 46,400 - Immediate Available: 46,400 RM3.77976 800 Minimum: 800 Tape & Reel (TR)
Alternate Packaging
105028 Active Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Nickel 50.0µin (1.27µm) Copper Alloy Thermoplastic
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1050281001 Datasheet 1050281001 - Molex WM6827CT-ND 1050281001 CONN CAM SOCKET 32POS GOLD 46,936 - Immediate Available: 46,936 RM6.60000 1 Minimum: 1 Cut Tape (CT)
Alternate Packaging
105028 Active Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Nickel 50.0µin (1.27µm) Copper Alloy Thermoplastic
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1050281001 Datasheet 1050281001 - Molex WM6827DKR-ND 1050281001 CONN CAM SOCKET 32POS GOLD 46,936 - Immediate Available: 46,936 Digi-Reel® 1 Minimum: 1 Digi-Reel®
Alternate Packaging
105028 Active Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Nickel 50.0µin (1.27µm) Copper Alloy Thermoplastic
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A-CCS 044-Z-T Datasheet A-CCS 044-Z-T - Assmann WSW Components 123-A-CCS044-Z-T-ND A-CCS 044-Z-T CONN SOCKET PLCC 44POS TIN 9,977 - Immediate Available: 9,977 RM4.26000 1 Minimum: 1 Tube
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Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polybutylene Terephthalate (PBT) -40°C ~ 105°C
110-44-424-41-001000 Datasheet 110-44-424-41-001000 - Mill-Max Manufacturing Corp. ED90055-ND 110-44-424-41-001000 CONN IC DIP SOCKET 24POS TIN 1,634 - Immediate Available: 1,634 RM4.89000 1 Minimum: 1 Tube 110 Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-308-41-001000 Datasheet 110-13-308-41-001000 - Mill-Max Manufacturing Corp. ED56083-ND 110-13-308-41-001000 CONN IC DIP SOCKET 8POS GOLD 3,094 - Immediate Available: 3,094 RM4.93000 1 Minimum: 1 Tube 110 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
14-3518-10 Datasheet 14-3518-10 - Aries Electronics A401-ND 14-3518-10 CONN IC DIP SOCKET 14POS GOLD 1,223 - Immediate Available: 1,223 RM4.97000 1 Minimum: 1 Bulk 518 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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08-3518-00 Datasheet 08-3518-00 - Aries Electronics A777AR-ND 08-3518-00 CONN IC DIP SOCKET 8POS GOLD 2,756 - Immediate Available: 2,756 RM5.10000 1 Minimum: 1 Bulk 518 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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110-93-314-41-001000 Datasheet 110-93-314-41-001000 - Mill-Max Manufacturing Corp. ED3314-ND 110-93-314-41-001000 CONN IC DIP SOCKET 14POS GOLD 2,290 - Immediate Available: 2,290 RM5.23000 1 Minimum: 1 Tube 110 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
A-CCS 068-Z-T Datasheet A-CCS 068-Z-T - Assmann WSW Components AE10059-ND A-CCS 068-Z-T CONN SOCKET PLCC 68POS TIN 14,710 - Immediate Available: 14,710 RM5.64000 1 Minimum: 1 Tube
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Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polybutylene Terephthalate (PBT) -40°C ~ 105°C
917-43-103-41-005000 Datasheet 917-43-103-41-005000 - Mill-Max Manufacturing Corp. ED90273-ND 917-43-103-41-005000 CONN TRANSIST TO-5 3POS GOLD 2,262 - Immediate Available: 2,262 RM5.73000 1 Minimum: 1 Tube 917 Active Transistor, TO-5 3 (Round)
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Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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22:31:45 10/20/2019