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Product Index > Connectors, Interconnects > Sockets for ICs, Transistors

Sockets for ICs, Transistors

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Compare Parts Datasheets Image Digi-Key Part Number Manufacturer Part Number Manufacturer Description Quantity Available
Unit Price
MYR
Minimum Quantity Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
1050281001 Datasheet 1050281001 - Molex WM6827TR-ND 1050281001 CONN CAM SOCKET 32POS GOLD 42,400 - Immediate Available: 42,400 RM4.72270 800 Minimum: 800 Tape & Reel (TR)
Alternate Packaging
105028 Active Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Nickel 50.0µin (1.27µm) Copper Alloy Thermoplastic
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1050281001 Datasheet 1050281001 - Molex WM6827CT-ND 1050281001 CONN CAM SOCKET 32POS GOLD 43,129 - Immediate Available: 43,129 RM8.24000 1 Minimum: 1 Cut Tape (CT)
Alternate Packaging
105028 Active Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Nickel 50.0µin (1.27µm) Copper Alloy Thermoplastic
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1050281001 Datasheet 1050281001 - Molex WM6827DKR-ND 1050281001 CONN CAM SOCKET 32POS GOLD 43,129 - Immediate Available: 43,129 Digi-Reel® 1 Minimum: 1 Digi-Reel®
Alternate Packaging
105028 Active Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Nickel 50.0µin (1.27µm) Copper Alloy Thermoplastic
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216-3340-00-0602J Datasheet 216-3340-00-0602J - 3M 3M1602-ND 216-3340-00-0602J CONN IC DIP SOCKET ZIF 16POS GLD 961 - Immediate Available: 961 RM84.70000 1 Minimum: 1 Tube Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
48-6554-11 Datasheet 48-6554-11 - Aries Electronics A309-ND 48-6554-11 CONN IC DIP SOCKET ZIF 48POS GLD 1,435 - Immediate Available: 1,435 RM105.39000 1 Minimum: 1 Bulk 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold
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Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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A 08-LC-TT Datasheet A 08-LC-TT - Assmann WSW Components AE9986-ND A 08-LC-TT CONN IC DIP SOCKET 8POS TIN 42,622 - Immediate Available: 42,622 RM0.73000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin
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Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin
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Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
A 14-LC-TT Datasheet A 14-LC-TT - Assmann WSW Components AE9989-ND A 14-LC-TT CONN IC DIP SOCKET 14POS TIN 41,129 - Immediate Available: 41,129 RM0.90000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin
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Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin
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Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
A 18-LC-TT Datasheet A 18-LC-TT - Assmann WSW Components AE9995-ND A 18-LC-TT CONN IC DIP SOCKET 18POS TIN 25,476 - Immediate Available: 25,476 RM1.10000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin
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Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin
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Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
ED281DT Datasheet ED281DT - On Shore Technology Inc. ED3050-5-ND ED281DT CONN IC DIP SOCKET 28POS TIN 8,914 - Immediate Available: 8,914 RM1.35000 1 Minimum: 1 Tube ED Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 110°C
110-44-308-41-001000 Datasheet 110-44-308-41-001000 - Mill-Max Manufacturing Corp. ED90048-ND 110-44-308-41-001000 CONN IC DIP SOCKET 8POS TIN 2,650 - Immediate Available: 2,650 RM2.00000 1 Minimum: 1 Tube 110 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AR 08 HZL-TT Datasheet AR 08 HZL-TT - Assmann WSW Components AE10011-ND AR 08 HZL-TT CONN IC DIP SOCKET 8POS TIN 10,390 - Immediate Available: 10,390 RM2.04000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin
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Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
4816-3000-CP Datasheet 4816-3000-CP - 3M 3M5463-ND 4816-3000-CP CONN IC DIP SOCKET 16POS TIN 4,276 - Immediate Available: 4,276 RM2.16000 1 Minimum: 1 Tube 4800 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
110-44-314-41-001000 Datasheet 110-44-314-41-001000 - Mill-Max Manufacturing Corp. ED90049-ND 110-44-314-41-001000 CONN IC DIP SOCKET 14POS TIN 1,926 - Immediate Available: 1,926 RM2.98000 1 Minimum: 1 Tube 110 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
SA163000 Datasheet SA163000 - On Shore Technology Inc. ED3016-ND SA163000 CONN IC DIP SOCKET 16POS GOLD 5,632 - Immediate Available: 5,632 RM3.06000 1 Minimum: 1 Tube SA Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
08-3518-10 Datasheet 08-3518-10 - Aries Electronics A400-ND 08-3518-10 CONN IC DIP SOCKET 8POS GOLD 3,900 - Immediate Available: 3,900 RM3.14000 1 Minimum: 1 Bulk 518 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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AR 14 HZL-TT Datasheet AR 14 HZL-TT - Assmann WSW Components AE10012-ND AR 14 HZL-TT CONN IC DIP SOCKET 14POS TIN 6,841 - Immediate Available: 6,841 RM3.22000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin
-
Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
110-43-308-41-001000 Datasheet 110-43-308-41-001000 - Mill-Max Manufacturing Corp. ED90032-ND 110-43-308-41-001000 CONN IC DIP SOCKET 8POS GOLD 6,380 - Immediate Available: 6,380 RM3.22000 1 Minimum: 1 Tube 110 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-308-41-001000 Datasheet 110-93-308-41-001000 - Mill-Max Manufacturing Corp. ED3308-ND 110-93-308-41-001000 CONN IC DIP SOCKET 8POS GOLD 997 - Immediate Available: 997 RM3.22000 1 Minimum: 1 Tube 110 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-99-316-41-001000 Datasheet 110-99-316-41-001000 - Mill-Max Manufacturing Corp. ED3116-ND 110-99-316-41-001000 CONN IC DIP SOCKET 16POS TINLEAD 1,559 - Immediate Available: 1,559 RM3.39000 1 Minimum: 1 Tube 110 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AR 16 HZL-TT Datasheet AR 16 HZL-TT - Assmann WSW Components AE10013-ND AR 16 HZL-TT CONN IC DIP SOCKET 16POS TIN 5,881 - Immediate Available: 5,881 RM3.67000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin
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Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A-CCS 032-Z-SM Datasheet A-CCS 032-Z-SM - Assmann WSW Components AE11105-ND A-CCS 032-Z-SM IC PLCC SOCKET 32POS TIN SMD 7,282 - Immediate Available: 7,282 RM3.75000 1 Minimum: 1 Tube
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Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled -40°C ~ 105°C
08-0518-10 Datasheet 08-0518-10 - Aries Electronics A774AR-ND 08-0518-10 CONN SOCKET SIP 8POS GOLD 2,687 - Immediate Available: 2,687 RM4.04000 1 Minimum: 1 Bulk 518 Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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A-CCS 044-Z-T Datasheet A-CCS 044-Z-T - Assmann WSW Components 123-A-CCS044-Z-T-ND A-CCS 044-Z-T CONN SOCKET PLCC 44POS TIN 2,259 - Immediate Available: 2,259 RM4.77000 1 Minimum: 1 Tube
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Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polybutylene Terephthalate (PBT) -40°C ~ 105°C
08-3518-00 Datasheet 08-3518-00 - Aries Electronics A777AR-ND 08-3518-00 CONN IC DIP SOCKET 8POS GOLD 778 - Immediate Available: 778 RM4.98000 1 Minimum: 1 Bulk 518 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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110-44-424-41-001000 Datasheet 110-44-424-41-001000 - Mill-Max Manufacturing Corp. ED90055-ND 110-44-424-41-001000 CONN IC DIP SOCKET 24POS TIN 4,877 - Immediate Available: 4,877 RM5.06000 1 Minimum: 1 Tube 110 Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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19:22:04 2/25/2020