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SIL PAD® TSP 3500
Bergquist's silicone elastomer is formulated to maximize the dielectric and thermal performance
Bergquist's SIL PAD TSP 3500 (formerly known as SIL PAD® 2000) is an electrically insulative, high-performance, thermally conductive interface material designed for demanding applications. The TSP 3500 is a silicone elastomer formulated to maximize the dielectric and thermal performance of the filler/binder matrix. The result is a compliant material that is ideal for challenging environments.
Features
- Thermal impedance: +0.33°C in ^2/W (at 50 psi)
- High thermal conductivity: 3.5 W/m-K
- High-reliability electrical insulator
- Sheet form and die-cut parts
- With or without pressure-sensitive adhesive
Applications
- Power supplies
- Motor controls
- Power semiconductors
- Aerospace
- Avionics
SIL PAD® TSP 3500
| Image | Manufacturer Part Number | Description | Available Quantity | Price | View Details | |
|---|---|---|---|---|---|---|
 |  | SP2000-0.015-00-104 | THERM PAD 25.4MMX19.05MM WHT | 3312 - Immediate | $5.75 | View Details |
|  | SP2000-0.015-00-58 | THERM PAD 19.05MMX12.7MM WHT | 0 - Immediate | $15.13 | View Details |
|  | SP2000-0.015-00-54 | THERM PAD 19.05MMX12.7MM WHT | 1178 - Immediate | $38.45 | View Details |
|  | SP2000-0.010-00-1212 | THERM PAD 304.8MMX304.8MM WHT | 30 - Immediate | $714.56 | View Details |
|  | SP2000-0.020-00-1212 | THERM PAD 304.8MMX304.8MM WHT | 51 - Immediate | $765.07 | View Details |
| | 2191805 | THERM PAD 304.8MMX304.8MM W/ADH | 15 - Immediate | $1,289.96 | View Details |
| | SP2000-0.010-AC-1212 | THERM PAD 304.8MMX304.8MM W/ADH | 0 - Immediate | $1,103.99 | View Details |
| | SP2000-0.015-00-1212 | THERM PAD 304.8MMX304.8MM WHT | 8 - Immediate | $993.39 | View Details |
| | SP2000-0.015-AC-1212 | THERM PAD 304.8MMX304.8MM W/ADH | 17 - Immediate | $1,063.01 | View Details |
| | SP2000-0.010-AC-124 | THERM PAD 22.15MMX20.07MM W/ADH | 0 - Immediate | $7.04 | View Details |
| | SP2000-0.015-00-62 | THERM PAD 19.05MMX15.24MM WHT | 0 - Immediate | $3.64 | View Details |
Published: 2024-04-11
