Adhesives, Epoxies, Greases, Pastes

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of 591

Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Size / Dimension	Usable Temperature Range	Color	Thermal Conductivity	Features	Shelf Life	Storage/Refrigeration Temperature
CW7270 HEAT SINK GREASE SILICONE FREE Chemtronics	294 In Stock	1 : RM69.73000 Bulk	CircuitWorks®	Bulk	Active	Non-Silicone Grease	7 gram Syringe	-99.4°F ~ 392°F (-73°C ~ 200°C)	White	0.71W/m-K	-	60 Months	-
CW7250 HEAT SINK GREASE BORON NITRIDE Chemtronics	130 In Stock	1 : RM97.77000 Bulk	CircuitWorks®	Bulk	Active	Non-Silicone Grease	3.4 gram Syringe	-99.4°F ~ 392°F (-73°C ~ 200°C)	White	1.85W/m-K	-	60 Months	-
9460TC-3ML THERMALLY CONDUCTIVE 1-PART EPOX MG Chemicals	123 In Stock	1 : RM104.33000 Bulk	9460TC	Bulk	Active	Epoxy Adhesive	3 ml Syringe	-85°F ~ 302°F (-65°C ~ 150°C)	White	0.80W/m-K	-	14 Months	50°F ~ 86°F (10°C ~ 30°C)
CT40-5 SILICONE GREASE 5 0Z TUBE Chemtronics	445 In Stock	1 : RM149.69000 Bulk	CircuitWorks®	Bulk	Active	Silicone Compound	5 oz Tube	5°F ~ 392°F (-15°C ~ 200°C)	White	0.63W/m-K	-	60 Months	-
1978-DP SILICONE FREE HEAT SINK COMP. Techspray	198 In Stock	1 : RM165.42000 Bulk	-	Bulk	Active	Non-Silicone Compound	4 oz Tube	-	Gray	-	-	60 Months	Ambient Temperature
TC3-10G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	428 In Stock	1 : RM168.12000 Bulk	CHIPQUIK®	Bulk	Active	Silicone Compound	5cc Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	60 Months	37°F ~ 77°F (3°C ~ 25°C)
65-00-GEL75-0010 THERM-A-GAP GEL 75 7.5 W/M-K DIS Parker Chomerics	167 In Stock	1 : RM211.00000 Bottle	THERM-A-GAP™ GEL 75	Bottle	Active	Silicone Gel	10cc Syringe	-67°F ~ 392°F (-55°C ~ 200°C)	White	7.50W/m-K	Low Outgassing (ASTM E595)	18 Months	50°F ~ 90°F (10°C ~ 32.22°C)
TC4-20G HEAT SINK THERMAL COMPOUND - DEE Chip Quik Inc.	42 In Stock	1 : RM245.24000 Bulk	CHIPQUIK®	Bulk	Active	Thermal Compound, Liquid Metal	20 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Silver	79.00 W/m-K	-	60 Months	68°F ~ 77°F (20°C ~ 25°C)
65-02-GEL75-0030 THERM-A-GAP GEL 75 7.5 W/M-K DIS Parker Chomerics	323 In Stock	1 : RM282.24000 Bottle	THERM-A-GAP™ GEL 75	Bottle	Active	Silicone Gel	30cc Syringe	-67°F ~ 392°F (-55°C ~ 200°C)	White	7.50W/m-K	Low Outgassing (ASTM E595)	18 Months	50°F ~ 90°F (10°C ~ 32.22°C)
8329TFS-50ML SLOW CURE THERM COND ADH FLOW MG Chemicals	71 In Stock	1 : RM292.65000 Bulk	8329TFS	Bulk	Active	Epoxy, 2 Part	45 ml Cartridge	-40°F ~ 302°F (-40°C ~ 150°C)	Black	1.20W/m-K	-	36 Months	50°F ~ 86°F (10°C ~ 30°C)
CW7100 CONDUCTIVE SILVER GREASE SYRINGE Chemtronics	689 In Stock	1 : RM296.19000 Bulk	CircuitWorks®	Bulk	Active	Silicone Grease	6.5 gram Syringe	-70°F ~ 485°F (-57°C ~ 252°C)	Silver	5.60W/m-K	-	120 Months	-
GF3500S35-07-60-50CC LIQUID GAP FILLER THERMAL CONDU Bergquist	142 In Stock	1 : RM320.73000 Bulk	Gap Filler 3500S35	Bulk	Active	Liquid Gap Filler, 2 Part	50cc Cartridge	-76°F ~ 392°F (-60°C ~ 200°C)	Blue	3.60W/m-K	-	5 Months	77°F (25°C)
1978-1 SILICONE FREE HEAT SINK Techspray	180 In Stock	1 : RM361.89000 Bulk	-	Bulk	Active	Non-Silicone Compound	1 lb Can	-	Gray	-	-	60 Months	Ambient Temperature
A17170-02 TPUTTY 508 Laird Technologies - Thermal Materials	36 In Stock	1 : RM494.70000 Box	Tputty™ 508	Box	Active	Silicone Compound	180cc Cartridge	-40°F ~ 302°F (-40°C ~ 150°C)	Green	3.70W/m-K	Low Outgassing (ASTM E595)	6 Months	-
127-20-10 GREASE 1GRAM SYRINGE 20W/M-K NON Wakefield-Vette	37 In Stock	1 : RM641.77000 Bulk	127	Bulk	Active	Non-Silicone Grease	1 gram Syringe	-58°F ~ 392°F (-50°C ~ 200°C)	Gray	20.00W/m-K	-	29 Months	-
1188119 STYCAST 2850FT BLK18# 8.16KG LOCTITE	127 In Stock	1 : RM1,340.39000 Bulk	LOCTITE® Stycast 2850FT	Bulk	Active	Epoxy, 2 Part (Order Catalyst Separately)	8.16 kg Container	-85°F ~ 221°F (-65°C ~ 105°C)	Black	-	-	18 Months	64.4°F ~ 77°F (18°C ~ 25°C)
GF3500S35-00-60-400CC LIQUID GAP FILLER THERMAL CONDUC Bergquist	68 In Stock	1 : RM1,453.13000 Bulk	Gap Filler 3500S35	Bulk	Active	Liquid Gap Filler, 2 Part	400cc Cartridge	-76°F ~ 392°F (-60°C ~ 200°C)	Blue	3.60W/m-K	-	5 Months	77°F (25°C)
TC1-10G HEAT SINK COMPOUND - HIGH DENSIT Chip Quik Inc.	130 In Stock	1 : RM39.65000 Bulk	-	Bulk	Active	Silicone Compound	10 gram Syringe	-	White	0.67W/m-K	-	60 Months	37°F ~ 77°F (3°C ~ 25°C)
65-02-GEL50VT-0030 THERM-A-GAP GEL50VT 5.2W/MK30CC Parker Chomerics	30 In Stock	1 : RM246.40000 Box	THERM-A-GAP™ GEL 50VT	Box	Active	Silicone Gel	30cc Syringe	-67°F ~ 392°F (-55°C ~ 200°C)	Gray	5.20W/m-K	Low Outgassing (ASTM E595)	12 Months	50°F ~ 90°F (10°C ~ 32.22°C)
A16872-03 TPUTTY 403 180CC CARTRIDGE Laird Technologies - Thermal Materials	61 In Stock	1 : RM554.72000 Bulk	Tputty™ 403	Bulk	Active	Liquid Gap Filler	180cc Cartridge	-49°F ~ 302°F (-45°C ~ 150°C)	White	2.30W/m-K	Low Outgassing (ASTM E595)	24 Months	-
127-12-10 GREASE 1 GRAM SYRINGE 12W/M-K Wakefield-Vette	41 In Stock	1 : RM615.73000 Bulk	127	Bulk	Active	Non-Silicone Grease	1 gram Syringe	-58°F ~ 392°F (-50°C ~ 200°C)	Gray	12.00W/m-K	-	29 Months	-
65-00-GREASE15-0010 THERM-A-GREASE 1.5 W/MK 10CC SYR Parker Chomerics	158 In Stock	1 : RM75.31000 Bulk	THERM-A-GREASE 15	Bulk	Active	Silicone Grease	10cc Syringe	-58°F ~ 392°F (-50°C ~ 200°C)	White	1.50W/m-K	Low Outgassing (ASTM E595)	12 Months	50°F ~ 90°F (10°C ~ 32.22°C)
65-00-GREASE30-0010 THERM-A-GREASE 3.0W/MK 10CC SYR Parker Chomerics	146 In Stock	1 : RM79.21000 Bulk	THERM-A-GREASE 30	Bulk	Active	Silicone Grease	10cc Syringe	-58°F ~ 392°F (-50°C ~ 200°C)	White	3.00W/m-K	Low Outgassing (ASTM E595)	12 Months	50°F ~ 90°F (10°C ~ 32.22°C)
65-00-GREASE70-0010 THERM-A-GREASE 7.0W/MK 10CC SYR Parker Chomerics	124 In Stock	1 : RM85.50000 Bulk	THERM-A-GREASE 70	Bulk	Active	Silicone Grease	10cc Syringe	-58°F ~ 392°F (-50°C ~ 200°C)	White	7.00W/m-K	Low Outgassing (ASTM E595)	12 Months	50°F ~ 90°F (10°C ~ 32.22°C)
A18835-01 TFLEX CR550 - 2X25CC SIDE-BY-SID Laird Technologies - Thermal Materials	29 In Stock	1 : RM256.50000 Box	Tflex™ CR550	Box	Active	Liquid Gap Filler	50cc Cartridge	-40°F ~ 392°F (-40°C ~ 200°C)	Blue	5.40W/m-K	-	6 Months	-

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Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.