T-Global Technology

OB Vapor Chamber

The T-Global OB vapor chamber is an efficient, ultra-thin passive heat spreading solution for high-performance electronics

Image of T-Global OB Vapor ChamberThe T-Global OB vapor chamber (OBVC) is a passive thermal management component designed to provide efficient, uniform heat dissipation across flat surfaces. Based on the same working principles as traditional heat pipes, the TG-OBVC consists of a sealed, flat enclosure filled with a working fluid that circulates via evaporation and condensation.

Features
  • Two-dimensional heat transfer
    • Promotes even thermal distribution across surfaces, improving cooling effectiveness
  • Passive operation
    • Functions without external power; utilizes internal phase-change dynamics
  • Consistent performance
    • Maintains thermal stability under varying heat loads
  • Low profile
    • Thickness options down to 0.4 mm for use in space-limited designs
Applications
  • Thermal management in high-density electronic assemblies
  • Systems requiring uniform surface temperature
  • Compact devices where traditional heat sinks are not viable

OB Vapor Chamber

ImageManufacturer Part NumberDescriptionAvailable QuantityPriceView Details
New Product
VAPOR CHAMBER 59MM X 56MM, COPPE		TGVC-59-56-3.0-OBVAPOR CHAMBER 59MM X 56MM, COPPE10 - Immediate$152.40View Details
Published: 2025-07-29