
HF115AC-0.0055-AC-90 | |
|---|---|
DigiKey Part Number | BER169-ND |
Manufacturer | |
Manufacturer Product Number | HF115AC-0.0055-AC-90 |
Description | THERM PAD 21.84MMX18.79MM W/ADH |
Manufacturer Standard Lead Time | 10 Weeks |
Customer Reference | |
Detailed Description | Thermal Pad Gray 21.84mm x 18.79mm Rectangular Adhesive - One Side |
Datasheet | Datasheet |
Category | Material Phase Change Compound |
Manufacturer Bergquist | Adhesive Adhesive - One Side |
Series | Backing, Carrier Fiberglass |
Packaging Bulk | Color Gray |
Part Status Active | Thermal Resistivity 0.35°C/W |
Usage TO-218, TO-220, TO-247 | Thermal Conductivity 0.8W/m-K |
Type Pad, Sheet | Shelf Life 12 Months |
Shape Rectangular | Shelf Life Start Date of Manufacture |
Outline 21.84mm x 18.79mm | Base Product Number |
Thickness 0.0055" (0.140mm) |
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | RM3.03000 | RM3.03 |
| 10 | RM2.69100 | RM26.91 |
| 25 | RM2.56400 | RM64.10 |
| 50 | RM2.47200 | RM123.60 |
| 100 | RM2.38250 | RM238.25 |
| 300 | RM2.24763 | RM674.29 |
| 500 | RM2.18748 | RM1,093.74 |
| 1,000 | RM2.10837 | RM2,108.37 |
| 5,000 | RM2.00458 | RM10,022.90 |
| Unit Price without VAT: | RM3.03000 |
|---|---|
| Unit Price with VAT: | RM3.33300 |





