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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
374324B00035G | |
|---|---|
DigiKey Part Number | HS318-ND |
Manufacturer | |
Manufacturer Product Number | 374324B00035G |
Description | HEATSINK BGA W/ADHESIVE TAPE |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level |
Datasheet | Datasheet |
Product Attributes
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Category | Length 1.063" (27.00mm) |
Mfr | Width 1.063" (27.00mm) |
Series | Fin Height 0.394" (10.00mm) |
Packaging Box | Power Dissipation @ Temperature Rise 3.0W @ 90°C |
Part Status Active | Thermal Resistance @ Forced Air Flow 9.30°C/W @ 200 LFM |
Type Board Level | Thermal Resistance @ Natural 30.60°C/W |
Package Cooled | Material |
Attachment Method Thermal Tape, Adhesive (Included) | Material Finish Black Anodized |
Shape Square, Pin Fins | Base Product Number |
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In-Stock: 2,457
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Quantity
All prices are in MYR
Box
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | RM10.44000 | RM10.44 |
| 10 | RM9.23100 | RM92.31 |
| 25 | RM8.79240 | RM219.81 |
| 50 | RM8.47580 | RM423.79 |
| 100 | RM8.16960 | RM816.96 |
| 250 | RM7.78120 | RM1,945.30 |
| 756 | RM7.33643 | RM5,546.34 |
| 1,512 | RM7.07048 | RM10,690.57 |
| 5,292 | RM6.61330 | RM34,997.58 |
| Unit Price without VAT: | RM10.44000 |
|---|---|
| Unit Price with VAT: | RM11.48400 |
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