SMD to DIP SOIC 22 0.050" (1.27mm) FR4 Epoxy Glass
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DIP300-SOIC-22N

DigiKey Part Number
315-DIP300-SOIC-22N-ND
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
DIP300-SOIC-22N
Description
DIP-22 (0.3" WIDTH, 0.1" PITCH)
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
SMD to DIP SOIC 22 0.050" (1.27mm) FR4 Epoxy Glass
Datasheet
 Datasheet
Product Attributes
Type
Description
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Category
Manufacturer
Chip Quik Inc.
Series
-
Packaging
Bulk
Part Status
Active
Proto Board Type
SMD to DIP
Package Accepted
SOIC
Number of Positions
22
Pitch
0.050" (1.27mm)
Board Thickness
0.063" (1.60mm)
Material
FR4 Epoxy Glass
Size / Dimension
1.100" L x 0.400" W (27.94mm x 10.16mm)
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In-Stock: 47
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Once available stock of this product has been depleted, manufacturer standard package and lead time will apply.
Quantity
All prices are in MYR
Bulk
QuantityUnit PriceExt Price
1RM52.84000RM52.84
5RM45.72800RM228.64
10RM43.19800RM431.98
25RM40.26040RM1,006.51
Manufacturers Standard Package
Unit Price without VAT:RM52.84000
Unit Price with VAT:RM58.12400