TS991SNL500T4
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TS991SNL500T4

DigiKey Part Number
315-TS991SNL500T4-ND
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
TS991SNL500T4
Description
SOLDER PASTE THERMALLY STABLE NC
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Chip Quik Inc.
Series
CHIPQUIK®
Packaging
Bulk
Part Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423°F (217°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Base Product Number
TS991S
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In-Stock: 19
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Quantity
All prices are in MYR
Bulk
QuantityUnit PriceExt Price
1RM452.57000RM452.57
5RM389.96000RM1,949.80
10RM365.66900RM3,656.69
25RM335.78040RM8,394.51
50RM314.73240RM15,736.62
100RM294.93190RM29,493.19
Manufacturers Standard Package
Unit Price without VAT:RM452.57000
Unit Price with VAT:RM497.82700
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