Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
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Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
BDN14-3CB-A01
BDN14-3CB-A01

BDN14-3CB/A01

DigiKey Part Number
294-1101-ND
Manufacturer
CTS Thermal Management Products
Manufacturer Product Number
BDN14-3CB/A01
Description
HEATSINK CPU W/ADHESIVE 1.41"SQ
Manufacturer Standard Lead Time
14 Weeks
Customer Reference
Detailed Description
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
CTS Thermal Management Products
Series
BDN
Packaging
Box
Part Status
Active
Type
Top Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Shape
Square, Pin Fins
Length
1.410" (35.81mm)
Width
1.410" (35.81mm)
Diameter
-
Fin Height
0.355" (9.02mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
5.60°C/W @ 400 LFM
Thermal Resistance @ Natural
16.20°C/W
Material
Aluminum
Material Finish
Black Anodized
Shelf Life
24 Months
Base Product Number
BDN14
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In-Stock: 3,423
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Quantity
All prices are in MYR
Box
QuantityUnit PriceExt Price
1RM13.04000RM13.04
10RM11.55200RM115.52
25RM11.00200RM275.05
50RM10.60500RM530.25
100RM10.22150RM1,022.15
250RM9.73588RM2,433.97
660RM9.38073RM6,191.28
Manufacturers Standard Package
Unit Price without VAT:RM13.04000
Unit Price with VAT:RM14.34400