Microcontrollers, Microprocessor, FPGA Modules

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Module/Board Type	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
ATSAMA5D27-SOM1 IC MOD CORTEX-A5 500MHZ 1GB 64MB Microchip Technology	135 In Stock	1 : RM159.02000 Tray	-	Tray	Active	MPU Core	ARM® Cortex®-A5	-	500MHz	64Mb Flash, 1Kb EEPROM	1Gb (128M x 8)	Edge Connector	1.180" L x 1.570" W (30.00mm x 40.00mm)	-40°C ~ 85°C (TA)
OSD3358-512M-BSM IC MODULE CORTEX-A8 1GHZ 512MB Octavo Systems LLC	0 In Stock Check Lead Time	1 : RM168.63000 Tray	OSD335x	Tray	Active	MPU Core	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	-	512MB	256-BGA	0.830" L x 0.830" W (21.00mm x 21.00mm)	0°C ~ 85°C
OSD3358-512M-ISM IC MODULE CORTEX-A8 1GHZ 512MB Octavo Systems LLC	0 In Stock Check Lead Time	1 : RM178.88000 Tray	OSD335x	Tray	Active	MPU Core	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	-	512MB	256-BGA	0.830" L x 0.830" W (21.00mm x 21.00mm)	-40°C ~ 85°C
BS2-IC IC MOD PIC16C57C 20MHZ 32B 2KB Parallax Inc.	227 In Stock	1 : RM193.06000 Bulk	BASIC Stamp®	Bulk	Active	MCU Core	PIC16C57C	-	20MHz	2KB EEPROM	32B	-	1.200" L x 0.600" W (30.00mm x 15.00mm)	0°C ~ 70°C
OSD32MP157C-512M-BAA SIP ARM CORTEX STM32MP157C Octavo Systems LLC	677 In Stock	1 : RM201.53000 Tray	OSD32MP15x	Tray	Active	MPU Core	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	650MHz, 209MHz	-	512MB	302-BGA	0.709" L x 0.709" W (18.00mm x 18.00mm)	0°C ~ 85°C
OSD32MP157C-512M-IAA SIP ARM CORTEX STM32MP157C Octavo Systems LLC	5 In Stock	1 : RM208.03000 Tray	OSD32MP15x	Tray	Active	MPU Core	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	650MHz, 209MHz	-	512MB	302-BGA	0.709" L x 0.709" W (18.00mm x 18.00mm)	-40°C ~ 85°C
XP1001000-05R IC MOD DSTNI-EX 25MHZ 256KB Lantronix, Inc.	11,008 In Stock	1 : RM216.38000 Tray	XPort®	Tray	Active	MPU Core	DSTni-EX	XPort AR	25MHz	512KB	256KB	RJ45	1.330" L x 0.640" W (33.90mm x 16.25mm)	-40°C ~ 85°C
XP1001000M-05R IC MOD DSTNI-EX 25MHZ 256KB Lantronix, Inc.	1,580 In Stock	1 : RM221.82000 Tray	XPort®	Tray	Active	MPU Core	DSTni-EX	XPort AR	25MHz	512KB	256KB	RJ45	0.570" L x 0.720" W (14.50mm x 18.30mm)	-40°C ~ 85°C
XP1002000-05R IC MOD DSTNI-EX 25MHZ 256KB Lantronix, Inc.	1,812 In Stock	1 : RM224.03000 Tray	XPort®	Tray	Active	MPU Core	DSTni-EX	XPort AR	25MHz	512KB	256KB	RJ45	0.570" L x 0.720" W (14.50mm x 18.30mm)	-40°C ~ 85°C
XPP1002000-02R IC MODULE IPV6 16MB Lantronix, Inc.	846 In Stock	1 : RM259.17000 Tray	XPort® Pro	Tray	Not For New Designs	MPU Core	IPv6	XPort® Pro	-	16MB	16MB	RJ45	0.630" L x 1.330" W (16.00mm x 33.90mm)	-40°C ~ 85°C
XPP1003000-04R IC MODULE IPV6 16MB Lantronix, Inc.	722 In Stock	1 : RM259.17000 Tray	XPort® Pro	Tray	Not For New Designs	MPU Core	IPv6	XPort® Pro	-	16MB	16MB	RJ45	0.630" L x 1.330" W (16.00mm x 33.90mm)	-40°C ~ 85°C
OSD3358-1G-ISM IC MODULE CORTEX-A8 1GHZ 1GB Octavo Systems LLC	0 In Stock Check Lead Time	1 : RM260.04000 Tray	OSD335x	Tray	Active	MPU Core	ARM® Cortex®-A8, AM3358	-	1GHz	-	1GB	256-BGA	0.830" L x 0.830" W (21.00mm x 21.00mm)	-40°C ~ 85°C
OSD3358-512M-ICB IC MOD CORTEX-A8 1GHZ 512MB 4GB Octavo Systems LLC	355 In Stock	1 : RM263.31000 Tray	OSD335x	Tray	Active	MPU Core	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	4GB	512MB	400-BGA	1.060" L x 1.060" W (27.00mm x 27.00mm)	-40°C ~ 85°C
MOD54415-100IR IC MOD COLDFIRE 250MHZ 64MB NetBurner Inc.	483 In Stock	1 : RM491.28000 Bulk	ColdFire®	Bulk	Active	MCU, Ethernet Core	ColdFire 54415	-	250MHz	32MB	64MB	RJ-45, 2x50 Header	2.950" L x 2.000" W (74.90mm x 50.80mm)	-40°C ~ 85°C
TE0720-04-61Q33MA IC SOC MODULE XILINX ZYNQ Trenz Electronic GmbH	32 In Stock	1 : RM1,189.88000 Bulk	-	Bulk	Active	Ethernet Core	ARM® Cortex®-A9	-	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
SM-K24-XCL2GC SOM K24 KRIA ZYNQ MPSOC AMD	40 In Stock	1 : RM1,231.25000 Bulk	Zynq® UltraScale+™ Kria™	Bulk	Active	FPGA Core	ARM® Cortex®-A53	Arm® Cortex®-R5F	533MHz, 1.333GHz	32GB eMMC	2GB	2 x 240 Pin	3.030" L x 2.360" W (77.00mm x 60.00mm)	0°C ~ 85°C (TJ)
SM-K26-XCL2GC SOM ARM A53 ZYNQ MPSOC KRIA K26 AMD	1,817 In Stock	1 : RM1,651.85000 Box	Zynq® UltraScale+™ Kria™	Box	Active	FPGA Core	ARM® Cortex®-A53	Arm® Cortex®-R5F	533MHz, 1.333GHz	16GB eMMC, 64MB QSPI	4GB	2 x 240 Pin	3.030" L x 2.360" W (77.00mm x 60.00mm)	0°C ~ 85°C (TJ)
SM-K24-XCL2GI SOM K24 KRIA ZYNQ MPSOC AMD	50 In Stock	1 : RM1,723.75000 Bulk	Zynq® UltraScale+™ Kria™	Bulk	Active	FPGA Core	ARM® Cortex®-A53	Arm® Cortex®-R5F	533MHz, 1.333GHz	32GB eMMC	2GB	2 x 240 Pin	3.030" L x 2.360" W (77.00mm x 60.00mm)	-40°C ~ 100°C (TJ)
SM-K26-XCL2GI SOM ARM A53 ZYNQ MPSOC KRIA K26 AMD	2,485 In Stock	1 : RM2,287.17000 Box	Zynq® UltraScale+™ Kria™	Box	Active	FPGA Core	ARM® Cortex®-A53	Arm® Cortex®-R5F	533MHz, 1.333GHz	16GB eMMC, 64MB QSPI	4GB	2 x 240 Pin	3.030" L x 2.360" W (77.00mm x 60.00mm)	-40°C ~ 100°C (TJ)
XP1001000-05R J XPORT XE, EXTENDED TEMPERATURE, Lantronix, Inc.	136 In Stock	1 : RM216.46000 Bulk	XPort®	Bulk	Active	-	DSTni-EX	XPort AR	25MHz	512KB	256KB	RJ-45	1.330" L x 0.640" W (33.90mm x 16.25mm)	-40°C ~ 85°C
XPP1004000-02R IC MODULE IPV6 16MB Lantronix, Inc.	297 In Stock	1 : RM230.41000 Tray	XPort® Pro	Tray	Not For New Designs	MPU Core	IPv6	XPort® Pro Lx6	-	16MB	16MB	RJ45	0.630" L x 1.330" W (16.00mm x 33.90mm)	-40°C ~ 85°C
OSD3358-512M-BCB IC MOD CORTEX-A8 1GHZ 512MB 4GB Octavo Systems LLC	0 In Stock Check Lead Time	1 : RM253.54000 Tray	OSD335x	Tray	Active	MPU Core	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	4GB	512MB	400-BGA	1.060" L x 1.060" W (27.00mm x 27.00mm)	0°C ~ 85°C
SCM-20260N-C SITCORE SCM20260N SOM GHI Electronics, LLC	270 In Stock	1 : RM273.36000 Tray	-	Tray	Active	MPU Core	SITCore	-	480MHz	16MB	32MB	-	-	-40°C ~ 85°C
XPP100200S-02R IC MODULE IPV6 16MB Lantronix, Inc.	56 In Stock	1 : RM277.69000 Box	XPort® Pro	Box	Not For New Designs	MPU Core	IPv6	XPort® Pro	-	16MB	16MB	RJ45	0.630" L x 1.330" W (16.00mm x 33.90mm)	-40°C ~ 85°C
SCM-20260E-B SITCORE SCM20260E SOM GHI Electronics, LLC	45 In Stock	1 : RM304.25000 Tray	-	Tray	Active	MPU Core	SITCore	-	480MHz	16MB	32MB	-	-	-40°C ~ 85°C

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Products in the modular embedded processor family integrate a microcontroller, microprocessor, digital signal processor, FPGA, or other such computational device together with support components such as memory, power management, timing, and other items necessary for their operation. They are suitable and intended for integration into an end product, and offer product developers access to modern computational and interface capabilities without necessity of high speed hardware design experience.

Microcontrollers, Microprocessor, FPGA Modules

Microcontrollers, Microprocessor, FPGA Modules

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