IC Sockets

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of 19,145

Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
A 08-LC-TT CONN IC DIP SOCKET 8POS TIN Assmann WSW Components	10,239 In Stock	1 : RM0.75000 Tube	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
A 14-LC-TT CONN IC DIP SOCKET 14POS TIN Assmann WSW Components	36,416 In Stock	1 : RM1.06000 Tube	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
110-87-308-41-001101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	17,946 In Stock	1 : RM2.30000 Box	110	Box	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AR 08-HZL-TT CONN IC DIP SOCKET 8POS TIN Assmann WSW Components	15,886 In Stock	1 : RM2.44000 Tube	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
4808-3004-CP CONN IC DIP SOCKET 8POS TIN 3M	36,098 In Stock	1 : RM2.70000 Tube	4800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
110-87-210-41-001101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	2,560 In Stock	1 : RM2.84000 Tube	110	Tube	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-44-308-41-001000 CONN IC DIP SOCKET 8POS TIN Mill-Max Manufacturing Corp.	5,294 In Stock	1 : RM3.10000 Tube	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
SA143000 CONN IC DIP SOCKET 14POS GOLD On Shore Technology Inc.	1,684 In Stock	1 : RM3.19000 Tube	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
SA163000 CONN IC DIP SOCKET 16POS GOLD On Shore Technology Inc.	3,529 In Stock	1 : RM3.63000 Tube	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
AR 16-HZL-TT CONN IC DIP SOCKET 16POS TIN Assmann WSW Components	4,139 In Stock	1 : RM4.56000 Tube	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
110-43-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	12,538 In Stock	1 : RM5.32000 Tube	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
A-CCS 032-Z-SM IC PLCC SOCKET 32POS TIN SMD Assmann WSW Components	4,292 In Stock	1 : RM5.49000 Tube	-	Tube	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polyamide (PA9T), Nylon 9T, Glass Filled	-40°C ~ 105°C
110-93-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	1,832 In Stock	1 : RM5.49000 Tube	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-99-316-41-001000 CONN IC DIP SOCKET 16POS TINLEAD Mill-Max Manufacturing Corp.	1,739 In Stock	1 : RM5.76000 Tube	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
1050281001 CONN CAM SOCKET 32POS GOLD Molex	3,103 In Stock	1 : RM7.09000 Cut Tape (CT) 800 : RM3.53249 Tape & Reel (TR)	105028	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Camera Socket	32 (4 x 8)	0.035" (0.90mm)	Gold	12.0µin (0.30µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.035" (0.90mm)	Nickel	50.0µin (1.27µm)	Copper Alloy	Thermoplastic	-
69802-432LF CONN SOCKET PLCC 32POS TIN Amphenol ICC (FCI)	2,507 In Stock	1 : RM7.35000 Cut Tape (CT) 390 : RM4.82008 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 125°C
A-CCS 044-Z-T CONN SOCKET PLCC 44POS TIN Assmann WSW Components	4,386 In Stock	1 : RM7.53000 Tube	-	Tube	Active	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
D01-9972042 CONN SOCKET SIP 20POS GOLD Harwin Inc.	6,925 In Stock	1 : RM7.84000 Tube	D01-997	Tube	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-44-424-41-001000 CONN IC DIP SOCKET 24POS TIN Mill-Max Manufacturing Corp.	1,526 In Stock	1 : RM7.89000 Tube	110	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
940-44-032-17-400000 CONN SOCKET PLCC 32POS TIN Mill-Max Manufacturing Corp.	1,264 In Stock	1 : RM8.02000 Tube	940	Tube	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
10-3513-10 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	937 In Stock	1 : RM8.11000 Bulk	Lo-PRO®file, 513	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
110-13-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	482 In Stock	1 : RM8.15000 Tube	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
D2816-42 CONN IC DIP SOCKET 16POS GOLD Harwin Inc.	3,337 In Stock	1 : RM8.20000 Tube	D2	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C
214-44-314-01-670800 CONN IC DIP SOCKET 14POS TIN Mill-Max Manufacturing Corp.	8,972 In Stock	1 : RM8.28000 Tube	214	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
SA406000 CONN IC DIP SOCKET 40POS GOLD On Shore Technology Inc.	1,494 In Stock	1 : RM8.33000 Tube	SA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C

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Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

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