Articles & Blogs

In this blog, I will walk through a simple experiment that uses an ultrasonic sensor and oscilloscope to measure how fast sound travels through the air.

Connectors for aerospace and defense integrate sophisticated materials, contact and body design, fabrication, and evaluation to meet mandated objectives.

Energy-efficient, low-latency components from NXP support Matter-enabled smart home networks while development tools help designers create new prototypes.

This blog will talk about the core concepts and the theory behind the circuit schematic and how it was approached.

As data processing increasingly moves closer to the edge, platforms that deliver efficient AI performance with low latency and high customization are needed.

A discussion on why 48 V is becoming the dominant power delivery network and how modular power solutions can speed and simplify transition.

Discover how ADI's ADF4382 PLLs with integrated VCOs enhance frequency stability and speed for high-speed data converter and 5G radio designs.

iWave Global has partnered with Xiphera to deliver quantum-safe cryptographic capability on iWave’s Agilex™ 5 System on Module (SoM) powered by Altera.

Growing industrial automation and the push for better energy efficiency are speeding up the adoption of VFDs in motor-driven systems.

Explore DigiKey Helping Hands features including magnetic PCB pillars, flexible arms, LED magnifier, and a heavy steel base for stable soldering.

As vehicles become more autonomous and data-centric, the need for a high-speed, scalable, and reliable in-vehicle communication backbone is greater than ever.

This in-depth webinar breaks down what it takes to select the right wire and cable for industrial environments.

In this blog, we’ll explore the hardware that’s being used, the science behind the transmission, and just how impressive a feat it is to achieve a 6km range.

Explore a hardware security workflow using firmware builds, simulation tools, serial commands, and automated tests for microcontroller systems.

An examination of the limitations of standard GFDI, the physics of high-impedance faults, and the practical challenges of locating them in 1500 V arrays.

Cable design needs to focus on the system concept, integrating the installation method, electrical and mechanical loads, as well as cost-effectiveness.

Older op amps offer designers confidence, while new ones offer vendors the potential for long-term bill-of-materials winners.

Learn how the BeagleBoard.org BeagleV-Fire single-board computer addresses common hurdles for running Linux in resource-constrained systems.

Single Pair Ethernet (SPE) has reshaped industrial connectivity. Now, with Power over Data Line (PoDL), SPE can deliver both data and power.

Discover how the XRP CoreXY chessboard prototype evolved with improved durability, lighting effects, and a compact transportable design.

Learn how the Hyper Cool Edge connector family can be used to support high-speed data interfaces for applications such as storage and AI datacenters.

An introduction to the world’s first NVMe PetaLinux solution operating at PCIe Gen4 speed without relying on the PCIe Hard Block of the FPGA.

A beginner-friendly guide to disassembling electronics, salvaging parts, and disposing of e-waste responsibly.

Accelerate AMR and AGV integration using motor controllers, IMUs, and ToF modules with native ROS 2 drivers.

Follow the setup and programming process for the VeryVerilog kit, including firmware loading and exploring built-in logic demos.

Follow the revival of an open-source self-balancing skateboard with upgraded motor, VESC controller, and improved design.

TE Connectivity’s relays are used in HVAC and refrigeration, appliances, industrial automation, automotive and transportation, and security and access control.

The automotive industry is moving to doing away with physical switches. Trunk and concealed door handle systems are being converted to a simple tap.

Although small, printed circuit board connectors serve an important role with dependable electrical connections between components and circuit board assemblies.

Learn how STEP, STL, OBJ, and 3MF file types store 3D models, differ in accuracy, compression, and metadata, and impact DIY workflows.

Evaluation boards and software enable designers to establish and characterize the performance of advanced motion control ICs under realistic load conditions.

The use of high-performance microcontrollers in IoT, AI and ML applications demand advanced memory, a wide array of peripherals, and security.

Learn how slim DIN rail power supplies, supported by a four-channel e-fuse, can be used to ensure successful industrial power installations.

Smart logistics fleets, production lines, and remote infrastructure rely on industrial PCs. Power instability threatens their reliability and data integrity.

Explore how ADI mmWave power amplifiers simplify design for commercial 5G and demanding military applications.

Safety components that once operated in isolation now communicate across networks bringing tremendous value, but it also creating risk.

Designers can use board-to-board connectors to achieve high-speed circuit density and enhance performance.

3M’s 8KDx Series PCIe 5.0 extender assemblies provide high-speed, high-integrity data transfer and fold for better space management and airflow.

Explore how to build, deploy, and manage Wi-SUN® mesh networks for large-scale IoT applications with a walkthrough of why Wi-SUN has become a leading standard.

Learn how a dual-path 10 Gsamples/s ADC architecture can be used to achieve accurate low-noise signal digitization from DC to 5 GHz.

Matching the performance of human-machine interface flat-panel displays to requirements in industrial networking applications is complex.

Learn how Altera Agilex 5 and Agilex 3 FPGAs with AI tensor blocks address edge AI challenges while speeding development with the FPGA AI Suite.

Discover how the XRP robot brings affordable robotics and AI education to classrooms with scalable curriculum and EDU discounts.

Rather than replacing existing fieldbus or industrial Ethernet infrastructure, IO-Link operates as a complementary interface.

The use of stacked capacitors results in higher capacitance in compact footprints, improved electrical performance, and enhanced design versatility.

Learn the core requirements that determine whether your invention qualifies for patent protection in the U.S.

A Field-Programmable Gate Array (FPGA) is an integrated circuit that can be programmed to replace large groups of digital logic circuits. In the 1970s.

This article shows Analog Devices connectivity solutions that address the unique security and patient safety concerns across a broad range of medical devices.

Significant health risks have been revealed associated with poor indoor air quality, driving increased health advisories and guidelines.

Texas Instruments’ MSPM0G110x family addresses these challenges by integrating the analog front-end directly into an 80 MHz Arm Cortex-M0+ microcontroller.

If you’ve ever needed to combine a Linux computer with an Arduino for AI and machine learning projects, the UNO Q offers both within a single board.

If you need to house small electronics without managing screws and fasteners, Hammond Manufacturing’s 1551SNAP and 1551V series are a practical solution.

Learn how to build sound reactive projects using piezos, microphones, and Arduino to trigger LEDs, motors, and effects from audio input.

Structured light, FPGA acceleration, and machine vision enable fast, accurate random bin picking for high-performance robotic automation systems.

A brief discussion of TE Connectivity’s large portfolio of top brands of interconnect products.

Arduino released the Arduino Uno Mini Limited Edition (LE), which is a smaller and slightly more powerful version that keeps all the power of the original in a new gold-and-black design. Let’s take a deep dive into what makes it special and how it compares to its older brother.

Learn how to map local hazards to the right architecture, select industry standard hardware, and make quality visible to pass inspection the first time.

Power relays form the electrical boundary between the high-power loads that perform real work in HVAC systems and the low-voltage control electronics.

Learn how Microchip’s CLB, CLC, and AVR CCL peripherals enable gate-level functions without external hardware.

Learn how multiprotocol wireless SoCs simplify the design of next-generation line-powered smart devices for LED lighting, smart plugs, and switches.

Plural, a patented, platform-based ADC architecture, delivers 10-, 12-, 14-, and 16-bit single and dual channel 5 MSPS – 250 MSPS solutions.

An intelligent link module can connect a standard circuit breaker and a contactor to create an intelligent digital load feeder.

A guide in how to effectively combine Arduino UNO Q with App Lab to accelerate prototyping and reduce build complexity.

An outline of a system-level approach to pneumatic design and how synchronizing six key component categories can improve energy efficiency.

The human brain is a marvel of nature, but unlike computers, it doesn’t rely on GPUs, AI accelerators, RAM, or hard drives, yet it internalizes and stores a lifetime of experiences, emotions, and knowledge.

Learn how 7.5-digit resolution can be achieved in high-performance instrument applications.

Achieve precise, low-noise clock distribution across multi-domain timing architectures using differential clock buffers with ultra-low additive jitter.

Designers can apply multiline connectors with hundreds of I/O paths to ensure high signal integrity in high-density applications with adjacent power buses.

Learn how GlobTek GTM96600 power supplies accelerate design and certification of mains-powered products destined for global markets.

Learn how radio frequency over fiber blends the rugged reliability of RF with the low loss, EMI immune advantages of fiber optics in this webinar.

In our previous blog, we talked about how we’re manufacturing a wiring harness, the essential electrical system in any automobile, for our FSAE car. This blog serves as a continuation and will cover our usage of connectors from DigiKey to make our lives easier and our car better!

A modern power distribution arrangement often requires a combination of isolated and non-isolated AC/DC and DC/DC power converters.

Learn how a waveform generation and measurement platform provides precision evaluation of next-generation audio converters and mixed-signal subsystems.

With mounting pressure to improve indoor air quality, advanced sensors have been developed to accurately measure and monitor a wide variety of air pollutants.

The European Cyber Resilience Act (CRA) aims to improve the security of products with digital components with mandatory cybersecurity requirements.

Anteater Formula Racing is a student-run engineering project at UC Irvine. The objective is to design, manufacture, and test a Formula-style car in less than a year to compete yearly in the Formula Society of Automotive Engineers competition in Michigan (FSAE).

The market is stabilizing, but OEMs need to continue preparation to react quickly to unforeseen supply chain events.

Designers can now use plug-and-play 3.5" IPS HDMI TFT modules to simplify display integration for industrial and medical applications.

A discussion of the features and benefits of HARTING’s modular configurator that streamlines decision making and ensures manufacturable designs.

First introduced by 3M in 1961, IDC has been refined over decades and expanded into a range of durable, field-installable connectors that streamline wiring.

Molex offers the HSAutoLink Interconnect System for robust in-vehicle data connectivity

A brief discussion of Radio Frequency over Fiber (RFoF), a technology that merges the advantages of optical fiber with the versatility of RF communication.

Firmware security has always been an afterthought. Therefore, the choice of memory architecture is a key decision in establishing a verifiable chain of trust.

Within these harsh environments, interconnects must hold up even when conditions push them far from typical operating limits.

For two decades, the Peripheral Component Interconnect Express (PCIe) standard has supported modern computing infrastructure with scalable bandwidth.

In the time between the First World War and World War II, the United States experienced a boom of industry and innovation.

A dive into rotary DIP switch basic functionality and continued relevance in modern electronic design.

Learn how advanced magnetic materials and packaging yield small, high-value, low-resistance, high-performance SMT inductors for power converters.

How to use an amplifier capable of handling high common-mode voltages to implement high-side current-sensing in automobile circuits.

Renewable energy sources are transforming electricity generation—but their output doesn’t always match when we need power most without effective storage.

Use benchtop load banks to reduce uncertainty when testing and qualifying three-phase power sources, generators, and backup systems.

A technical specification framework for wall-mount rack enclosures prioritizing serviceability, physical security, and space footprint.

Explore how GMSL technology expands from automotive to broader industries, from GMSL1-generation MAX96705 to 3rd-gen MAX9296A.

TE Connectivity’s Quick Disconnect portfolio includes insulated and uninsulated terminals, with many available features.

Explore how displays evolved, from neon indicators and Nixie tubes to modern OLED and e-ink, and what that means for your electronics project.

Learn how wide-input DC/DC converters for railways can be used in harsh environments while meeting regulatory requirements.

The coming year will be challenging for memory buyers, making innovative sourcing practices critical to the success of small OEMs.

Batteries aren’t just voltage sources; balanced cells reduce losses, heat, and risk of failure. Here’s how to manage yours.

Qorvo’s QPA9442 wideband, high-linearity driver amplifier operates across a 0.6 to 5.0 GHz frequency range with optimized tuning and integrated protection.

The nRF54L15 is Nordic Semiconductor’s transition to a 22nm process node, moving from the established nRF52 Series architecture.