Slide 1 Slide 2 Slide 3 Slide 4 Slide 5 Slide 6 Slide 7 Slide 8 Slide 9 Slide 10 Slide 11 Slide 12 Slide 13 Slide 14 Slide 15 Slide 16 Slide 17 Slide 18 Slide 19 Slide 20 Slide 21 Slide 22 Slide 23 Product List
Tiva C Series TM4C123x Family of MCUs Slide 12

Each ADC module has a temperature sensor that can be used to sense the die temperature for reliable system operation. It can also be used to obtain temperature measurements in order to calibrate the hibernation module's RTC trim value. The internal temperature sensor module consists of a band gap reference circuit that provides reference voltages to various analog modules. The relation between the reference voltage and die temperature is mathematically expressed by the first equation shown on this slide. In most applications, the internal temperature sensor can be used to provide a rough estimation of the die temperature. The relation between the temperature and ADC output code can be expressed mathematically using the second equation shown.

PTM Published on: 2013-09-10